IC Device Decapsulation
Overview
At Outermost Technology, we offer specialized IC chip decapsulation services, essential for revealing the intricate internal structures of semiconductor components. This process is crucial for thorough analysis in failure investigation, quality control, and authenticity verification, particularly in the highly complex field of semiconductor technology.
Our expert team employs advanced decapsulation techniques, including acid jet etching and precision mechanical methods, to expose the internal architecture of IC chips without compromising their delicate structures. This careful procedure allows for detailed inspection of die, wire bonds, and internal circuitry, providing invaluable insights into manufacturing quality, material integrity, and design effectiveness.
Whether you’re involved in semiconductor manufacturing, electronic product development, or intellectual property evaluation, Outermost Technology’s decapsulation services are pivotal in ensuring the reliability and performance of IC components. Trust our expertise to deliver the precise analysis needed to drive innovation and maintain the highest standards in semiconductor technology.
Services
- Decapsulation of various packages
Pricing
- Regular service: Starts from $150/sample.
Equipment
- Various packaging materials by chemicals or fiber laser
- Selective area decapsulation
- Laser decapsulation to remove the Cu wire package without damaging.
FAQ
A: IC chip decapsulation is the process of removing the outer protective material of an integrated circuit (IC) chip to expose its internal components, such as the die and wire bonds, for detailed analysis and inspection.
A: Decapsulation is crucial for detailed internal examination of IC chips. It helps in identifying manufacturing defects, verifying authenticity, conducting failure analysis, and understanding the overall design and construction of the chip.
A: We use advanced techniques, including acid jet etching and precision mechanical methods, to ensure the integrity of the chip’s internal structures during decapsulation.
A: Yes, when performed by experts like us, decapsulation is a safe process that carefully exposes the internal components without damaging them, allowing for accurate analysis.
A: Absolutely. Decapsulation allows us to examine the internal structures and components of IC chips, which is essential in identifying counterfeit products.
A: The duration depends on the complexity of the chip and the chosen method. However, we strive to provide timely services without compromising on precision.
A: Decapsulation reveals the chip’s internal layout, wire bonding patterns, die size, and any signs of internal damage or manufacturing anomalies.
A: There are minimal risks when the process is handled by skilled technicians. Our team is trained to manage these risks effectively, ensuring the safe handling of your IC chips.
A: We have the capability to work with a wide range of IC chips. However, we recommend consulting with our experts to discuss the specifics of your chip type.
A: We ensure quality through the use of advanced equipment, adherence to industry standards, and the expertise of our technicians, backed by rigorous quality control processes.