Jul. 2024

Dynamic SIMS analysis of p- and n- doping profiles in silicon

Jun. 2024

Shelf-life deposition analysis of polymer by GPC

May 2024

High resolution XPS analysis of graphene focused on carbon bonding types

Apr. 2024

Surface morphology analysis of bio-sensors

Mar. 2024

XPS analysis on IC chip to determine corrosivity damage

Feb. 2024

Ferrite material analysis with Cs-TEM

Jan. 2024

CTE measurement of dielectric amorphous films

Dec. 2023

ICP-OES to quantify unknown component elements

Nov. 2023

Polymer characterization with multiple techniques: FTIR, GPC, Raman, TGA, and DSC

Oct. 2023

Ion Chromatography analysis of solvent samples for fluorine in ppb level

Sep. 2023

MALDI-ToF analysis of polymer samples

Aug. 2023

ICP-MS and IC anion analysis for new electrolyte development

Jul. 2023

Unknown particle defect analysis on wafer using TEM-EDS

Jun. 2023

Purity analysis of organic material batch using ICP-MS and IC

May 2023

Cs-TEM-EDS of a bulk copper piece coated with unknown graphene.

Apr. 2023

SEM-EDS on a glass piece to identify defects.

Mar. 2023

X-sectional polishing of LED device for FA at interfaces

Feb. 2023

Nano-scale analysis of onion shape graphene with Cs-TEM

Jan. 2023

EBSD analysis of tungsten film

Dec. 2022

Structure/composition analysis of HEMT by TEM/EDS

Nov. 2022

Two-side Polishing of Micro LED Device

Oct. 2022

Unknown coating material analysis of parts used in plasma process chamber

Sep. 2022

Layer structure analysis of graphene using Cs-TEM

Aug. 2022

Failure analysis of metallized ceramic using 3D CT, CSAM, and SEM-EDX

Jul. 2022

Karl Fisher/FTIR/GC-FID analysis of an organic solvent

Jun. 2022

C-, F-, and H- NMR analysis of organic solutions for graphene

May 2022

XPS analysis for an identification of organic contaminations

Apr. 2022

TEM/EDS analysis on HEMT device

Mar. 2022

Hi-resolution d-XPS analysis for ITO for uLED application

Feb. 2022

C-SAM for advanced wafer bonding technology

Jan. 2022

Device structure analysis using FIB-TEM-EDS analysis of a whole wafer

Dec. 2021

Electrical and structural analysis of high capacitance materials in MIM structure

Nov. 2021

Cross-sectional failure analysis of micro-LED display parts

Oct. 2021

Analysis of biological molecules using Nanoscale FTIR

Sep. 2021

Quantification and identification of fungicidal toxins in fruit

Aug. 2021

Electrochromic device dopant identification and profile using ion milling and SSRM

Jul. 2021

Contaminant analysis of electrolyte solutions using ICP-MS and GC-MS

May 2021

Polymeric structural characterization using Nuclear Magnetic Resonance (NMR)

Apr. 2021

SEM analysis of battery composites

Mar. 2021

Fluorescence measurement of plastic films for research

Feb. 2021

DSC measurement of metal alloys for development

Feb. 2021

Metal composition testing by ICP for alloy development

Jan. 2021

Flash point measurements for solvents for development

Jan. 2021

Ion chromatography of semiconductor samples for failure anlaysis

Dec. 2020

Optical measurements on silver coated mirrors for research

Dec. 2020

LA-ICP-MS for trace metal analysis of semiconductor films for development

Nov. 2020

TGA measurements of polymer samples for development

Nov. 2020

TEM and EDS of LED Device Structures for failure analysis

Oct. 2020

XRR for density and thickness of dielectric films for semicondcutor development

Oct. 2020

XPS Depth profiles of metal oxide films for semiconductor research

Sep. 2020

NMR of polymer samples to measure ligand ratios for polymer development

Sep. 2020

Kelvin probe measurements of LED device structure for research

Aug. 2020

Heated ellipsometry measurements for medical devices for research

Aug. 2020

RBS measurements of ferroelectric thin films for memory development

Jul. 2020

Cross section SEM measurements on coated metals for semiconductor development

Jul. 2020

ToF depth profiles on LED device structures for semiconductor failure analysis

Jun. 2020

Extensive analysis of carbon powerder using TEM/EDS/TGA/XPS/FTIR/SEM for new graphene development

Jun. 2020

TEM+EDS analysis of GaN device structures for power device development

May 2020

Optical profilometry for defect characterization on transparent plastics for nuclear industry

May 2020

Reverse engineering of glue sample using DSC and FTIR for pest control failure anlaysis

Apr. 2020

GC-MS testing for toxicoloy of avocados for food development

Apr. 2020

Nano-FTIR of dielectric films for studying surface bonding for new semiconductor materials

Mar. 2020

M-SIMS depth profiles of doped material for optical telecommunication application

Mar. 2020

EELS Measurements on Dielectric films for semiconductor research

Feb. 2020

TEM/SEM/XRD/Uv-Vis analysis of Ag nanowires for transparent displays application

Feb. 2020

Measuring surface area of carbon powders using nitrogen gas for graphene industry

Jan. 2020

Polymer identification using TGA hyphenated to a GC-MS for semiconductor failure analysis

Jan. 2020

High Resolution ToF-SIMS depth profiles of Magnetic RAM (MRAM) development

Jul. 2024

Real time TEM analysis of photonics devices

Jun. 2024

Root cause analysis of a local corrosion on PCBA used in data center

May. 2024

CIS image sensor (SKHynix) design analysis for IP litigation

Apr. 2024

Structure/composition analysis of a BSI CMOS image sensor

Mar. 2024

Row driver analysis of a CIS module from a major manufacturer

Feb. 2024

Gas corrosion testing for PCBAs

Jan. 2024

TSV analysis of DDR4 memory device

Dec. 2023

Failure analysis of slightly opened coil

Nov. 2023

CIS image sensor (Samsung and Sony) design analysis for IP litigation

Sep. 2023

Structure analysis of HBM2 memory device packaging

Aug. 2023

Die imaging of IC device for AI application

Jul. 2023

X-sectional analysis of DDR5 focused on airgap and liner layers

Jun. 2023

Multi-stack CIS image sensors from major brand smartphones

May 2023

TSV structure analysis of DDR5 DRAM device

Mar. 2023

Full process analysis report release of a SoC device of a major brand smartphone

Nov. 2022

Top down high-resolution imaging of fin and gate from 14nm FinFET based device

Sep. 2022

Package and process analysis of SoC used in major brand smartphone

Jul. 2022

3D CT failure analysis of new circuit board stack structure

Jun. 2022

Decapsulation of metal packaged server CPU

May 2022

Contract on the development of a new application of SCM for nano-LED application

Apr. 2022

Die marking imaging for a full SSD products of a major manufacturer

Feb. 2022

Image sensor dopant profile analysis in a smartphone camera of a key manufacturer

Jan. 2022

Charge trap cell structure analysis of NOR and NAND devices from a major manufacturer

Dec. 2021

Identification of top oxide layer on active fin from an advanced DRAM product

Nov. 2021

Extensive reliability testing of a wearable device for health monitoring

Sep. 2021

Comprehensive 5nm FinFET process analysis from Apple A14 AP chip from the 1st biggest foundry and functional block analysis is also done

Aug. 2021

SCM & SSRM scanning, Hall measurement to check Ohmic contact to p-GaN in a nanowire LED device

Jun. 2021

Comprehensive process analysis report for mobile SoC chip having 14nm FinFET process from the 2nd biggest foundry

Apr. 2021

OLED pixel analysis with dopant identification and profiles using Cs-TEM, u-spot d-XPS, and SCM

Mar. 2021

Complete functional block analysis of SSD SoC chips including SRAM size estimation for key

Feb. 2021

Thorough analysis of nanorod structure for u-LED application using Cs-TEM/EDS/EELS

Dec. 2020

High speed SSD (1700MB/s) SoC analysis with its SRAM and metal process

Jun. 2020

Merged contact structure comparison of Sony PS4 Pro, Xbox One X, and Nintendo Switch

Apr. 2020

3D NAND memory structure analysis with planeview and cross-section with Cs-TEM/EDS

Feb. 2020

Layer structure and material analysis of Micron DRAM with 20 nm technology

Sep. 2019

Toshiba image sensor analysis

Dec. 2019

Functional block analysis of Intel SSD SoC for 8TB product

Oct. 2019

Dopant profile and type analysis of Toshiba’s 15 nm technology-based NAND memory by SCM and SSRM

Sep. 2019

Charge trap memory cell analysis of 3D NAND Flash memory

Aug. 2019

65 nm node image sensor analysis used for SONY A9 digital camera